The processor is the core of every mobile phone, so in this article, I will introduce the Kirin 990 5G processor to you, let’s take a look.
The Kirin 990 5G processor uses TSMC’s 7nm EUV process, integrating 10.3 billion transistors, the first time it has exceeded 10 billion in a mobile SoC, with a chip area of 113.31 square millimeters, or about 90.9 million transistors per square millimeter.
Huawei’s next-generation flagship SoC is said to be called Kirin 1020, code-named Baltimore. It is reported that the performance of Kirin 990 can be improved by as much as 50%. The main reason is that the CPU architecture has been upgraded from A76 to A78, leading Qualcomm Snapdragon 865. The A77 used in the MediaTek Dimensity 1000 also comes standard with an integrated 5G baseband.
The Kirin 1020 is almost locked in the TSMC 5nm process, and the transistor density will naturally be greatly improved. The latest news says that it is expected to reach about 171.3 million per square millimeter, an increase of nearly 90% compared to the Kirin 990 5G.
5nm will be another important process node for TSMC. Using the fifth-generation FinFET transistor technology, EUV extreme ultraviolet lithography technology has also expanded to more than 10 lithography layers, and is divided into two versions: N5 and N5P. The former is compared to N7. The performance of the 7nm process is increased by 15% and the power consumption is reduced by 30%. The latter continues to improve the performance by 7% and reduce the power consumption by 15% on the basis of the former.
TSMC is currently trial-producing 5nm, and the average yield of test chips is as high as 80%, with a maximum of over 90%. It is expected to put into mass production in the first half of next year.
The above is what I want to share with you this time, I hope you like this article. Finally, thank you very much for reading.
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